The IL400L is the first ultra-precision machine equipped with a femto-second laser for next-level glass, ceramic and silicon carbide machining. Various processes such as “Selective Laser Etching”, “Wafer Beveling” or “Face Side Structuring” can be executed based on different laser focusing modules that are individually introduced to the machine with the NanoGrip interface. The laser is uniquely integrated into the machine controller to allow for quasi continuous surface energy input while running on ultra-precise polar kinematics. This technology significantly differs from state-of the art galvanometer scanners for laser beam guidance. Advantages of the IL400L approach are the stand-still laser focus without Abbé influences, the on-center beam to easily correct for spherical abberations, the long working distance compared to scanners, and especially no need for stitching to address larger surfaces. Get in contact with us to explore the IL400L and its new technology!

Key Features

Selective Laser Etching

Diamonds cannot machine glass, but the laser can! The selective laser etching process has been known to industry for over a decade, but it has never been introduced to an ultra-precision lathe for machining optics. To create a double-sided optic in fused silica, a laser focus is being guided on a tool path to inscribe the geometry in the bulk material of a cylinder. Writing from the back to the front, the entire geometry is written inside the glass. Due to the laser intensity in the focus spot the glass characteristics are modified in a way that subsequent etching is significantly accelerated in the regions of laser modification. The etching takes place selectively in such regions to extract the intended geometry. Front and backside are perfectly aligned as there is no need to swap the part as in grinding. The etching does not create any sub-surface damage, as there is no mechanical impact. Contact us to learn how ILSLE will revolutionize the machining of fused silica optics!

Wafer Beveling

Wafers need a defined geometry on the circumference consisting of chamfers and radii to avoid imperfections during coating processes. The IL400L can create such geometries by pure laser ablation – free of tool wear, mechanical stress and at highest speeds. The high relative speeds on the circumference of the rotating wafer combined with commercially available high laser powers allow for unmatched productivity. Adapting the laser parameters the IL400L combines laser roughing with removal rates of 10 mm3 /min and laser finishing with a surface roughness down to below 100 nm Sa.

Face Side Structuring

The laser beam of the IL400L can be triggered at 10 or even 50 kHz to continuously remove material with a locally deterministic energy input on the face side of a rotating part. Use it to create continuous shapes of a smooth surface or to texture surfaces with structures in materials you would never imagine to machine on a diamond turning lathe. With the on-axis laser beam guidance, laser spot foci of down to 2 µm in diameter are feasible to resolve smallest structures. Explore the new options for the IL400L for your product requirements.

Laser Assisted Cutting

Alternatively, to the femto-second laser, the IL400L can be equipped with a diode laser to conduct hybrid laser assisted cutting of infrared and tungsten carbide materials. Our unique glass fiber coupling of the laser beam to the diamond allows for dynamic free form generating at lowest moving weight and highest stability of the optical system. The certified laser safety concept of the machine allows for a direct start of the technology in your production.

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